With 5+ years of experience in PCB prototyping and quick-turn services, AETEMS has built a high-tech manufacturing system, especially for quick-turn and high-mix low-volume orders to shorten the R&D period of customers.
Key Features
Multi-layer PCB
1.Up to 100 layers;
2.Vacuum resin plug hole, Back drilling are normal process;
3.Multi-variety materials are in stock, such as FR-4 TG150, TG170, TG180.
Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO4835 etc.
Rogers RT/duroid 5870, RT/duroid 5880, RT/duroid 6002, RT/duroid 6010;
4.Capacity is 50000 square meters per month For rigid PCB.
Rigid-Flex PCB
1.Metal-plated holes and PTH Pad on FPC can realize build-buried holes connecting and soldering;
2.Isolated design of multi-layer flexible FPC can fulfill the needs of wide angle or dynamic bending;
3.Exposed FPC and IC stiffener enable the connection of placed components including modules or ICs at any angles;
4.FPC with electromagnetic shielding film fulfills the needs of the electrostatic shielding, magnetic shielding, low frequency alternating magnetic shielding and high frequency electromagnetic shielding;
5.laser blind holes on rigid-flex PCB enable the connection of any layers;
6.Metal-laminated rigid-flex PCB enable better heat radiating.
HDI PCB
1.Multi-step HDI enables the connection between any layers;
2.Cross-layer laser processing can enhance the quality level of multi-step HDI;
3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.
High Frequency / Microwave PCB
1.Multi-layer PTFE laminating enables super high frequency PCB;
2.Laser cutting technology for PTFE laminates can ensure the high accuracy of outlines;
3.Plasma excitation can improve the adhesion of cooper in PTH for those high-frequency laminates and hence improve the reliability of inner-outer layer connection;
4.Special techniques like stepped milling, laser blind-buried holes (HDI) are available for high-frequency PCB;
5.Our lamination technology enables the mixture of high-frequency laminates, high-speed laminates, FR4, PI, metal laminates and other materials
Metal Core / Metal Base PCB
1.Multi laminating aluminum-based PCBs / Soldering technology to cooper-base PCBs fulfill the needs of better heat radiating on multi-layer PCBs;
2.Buried magnetic core technology for metal-based PCBs with metal laminates in the middle enables heat radiating and also small size integration;
3.The technology of partially buried copper fulfills the needs of cost saving, small size integration and high radiating;
4.The design capability of concentric circles in metal base PCBs enables the isolation between fix holes and PTH holes in those PCBs;
5.The integrated coursing technology in metal base PCBs ensures the high reliability between metal base and epoxy resin or hydrocarbon laminates.
Characteristics and Advantages
Key Technology
Professional R&D on high density HDI, multi-layer PCB, rigid-flex PCB, embedding technology of small size core, thick GEM, PCB with special requirements from industries like defense / medical / automotive, and others technologies.
Qualified Suppliers
Sourcing from Rogers, Shengyi, ISOLA, Dupont, Rohmhass, Atotech and other excellent suppliers.
Quality Certificates
ISO standard quality system certificates, high standard environmental-friendly production.
Quality Guarantee
AETEMS serves for a wide range of industries with mature quality systems certificated with ISO9001/ISO14001. With our quality assurance process and management tools e.g.SPC, MSA, FMEA, APQP and PPAP, AETEMS could both ensure the quality and delivery following a wide range of features and requirements from 15000+ R&D customers. All of our PCB will go through 100% E-testing and AQI checking and could also go through various testing for reliability including high voltage, high-low temperature, impedance control, micro-section, solderability, thermal stressing, isolated resistor, ionic contamination, and else.
Application
AI, Telecom, Industrial control, Medical, Electricity, Automotive, PCs.
Capability
Max 100L, ±1.0mil tolerance control for line, min 0.1mm drill bit.
