PCB Capabilities
|
Item |
Lot Size |
||||
Normal |
Special |
Remark |
|||
PCB(used for SMT)spec |
(L*W) |
Min |
L≥50mm |
L<50mm |
Includes the Process Edge |
Max |
L≤460mm |
L > 460mm |
|||
(T) |
Min thickness |
0.5mm |
T<0.5mm |
||
Max thickness |
4.5mm |
T>4.5mm |
|||
SMT components spec |
outline dimension |
Min size |
0201 |
01005 |
/ |
Max size |
200mm*125mm |
200mm*125mm<SMD |
/ |
||
component thickness |
T≤6.5mm |
6.5mm<T≤15mm |
/ |
||
QFP、SOP、SOJ(multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch<0.4mm |
/ |
|
CSP,BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch<0.5mm |
/ |
Item |
Prototype Manufacturer |
||||
Normal |
Special |
Remark |
|||
SMT PCB SPEC |
(L*W) |
Min size |
L≥50mm |
L<50mm |
Includes the Process Edge |
Max size |
L≤450mm |
L:800-450mm |
|||
(T) |
Minimum thickness |
0.8mm |
T<0.8mm |
||
Maximum Thickness |
2mm |
T>2mm |
|||
DIP PCB SPEC |
(L*W) |
Min Size |
L≥50mm |
L<50mm |
|
Max Size |
L≤500mm |
L≥500mm |
|||
(T) |
Minimum Thickness |
0.8mm |
T<0.8mm |
||
Maximum Thickness |
2mm |
T>2mm |
Item |
Parameter |
||
Max Design Layer |
100L |
||
Min Trace Width / Space |
Inner Layer |
2mil |
|
Out Layer |
2mil |
||
Min Hole Diameter |
CNC |
6mil |
|
Laser |
4mil |
||
Max PIN Quantity in a Board |
50000PIN |
||
Max BGA Quantity in a Board |
30PCS |
||
Min Space Between two BGA |
0.35mm |
||
Max Signal |
40Gbps |
||
Product Type |
Data Communication Products |
ATCA、AMC、CPCI、PCIE |
|
Optical Network Products |
SDH/DWDM、LMDS、GSM/GPRS |
||
Multimedia Products |
Video Telephone, Conference TV, Monitoring Equipment, etc. |
||
Computer Product |
MB、NB、SERVER main board |
||
Aerospace Products |
Satellite Navigation, Flight Control System, Communication Positioning System |
||
Industry Control Product |
ARM、DSP、X86 |
||
Consumer Product |
Smart Home Appliances, Smart Phones, Smart Clothes, etc. |
EMS Capabilities
CAD Capabilities